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Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications
Materials, Processing, Reliability

by James J. Licari,Dale W. Swanson

  • Publisher : William Andrew
  • Release : 2011-06-24
  • Pages : 512
  • ISBN : 9781437778908
  • Language : En, Es, Fr & De
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Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: • Tamper-proof adhesives for electronic security devices. • Bio-compatible adhesives for implantable medical devices. • Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). • Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices. A complete guide for the electronics industry to adhesive types, their properties and applications – this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionals Provides specifications of adhesives for particular uses and outlines the processes for application and curing – coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device Discusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel

Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
Materials, Properties and Applications

by M O Alam,C Bailey

  • Publisher : Elsevier
  • Release : 2011-05-25
  • Pages : 280
  • ISBN : 0857092898
  • Language : En, Es, Fr & De
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Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
A Book

by Haleh Ardebili,Jiawei Zhang,Michael Pecht

  • Publisher : William Andrew
  • Release : 2018-10-23
  • Pages : 508
  • ISBN : 0128119799
  • Language : En, Es, Fr & De
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Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them

Japanese Current Research

Japanese Current Research
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1986
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Japanese Technical Abstracts

Japanese Technical Abstracts
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1987
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Electronics Applications of Polymers II

Electronics Applications of Polymers II
A Book

by M.T. Goosey

  • Publisher : iSmithers Rapra Publishing
  • Release : 2000
  • Pages : 136
  • ISBN : 9781859572238
  • Language : En, Es, Fr & De
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Electronics applications of polymers continue to advance, and this report describes the major developments in the last decade. The report looks at the important properties of polymers and discusses their role in printed circuit board (PCB) and related interconnect applications and in microelectronics. Additionally, the various lithographic routes available for future semiconductor device manufacture are discussed. An additional indexed section containing several hundred abstracts from the Rapra Polymer Library database gives useful references for further reading.

Japanese Technical Bibliography

Japanese Technical Bibliography
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1987
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Electrically Conductive Adhesives

Electrically Conductive Adhesives
A Book

by Rajesh Gomatam,Kashmiri Lal Mittal

  • Publisher : BRILL
  • Release : 2008-12-23
  • Pages : 426
  • ISBN : 9004165924
  • Language : En, Es, Fr & De
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This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).

Coating Materials for Electronic Applications

Coating Materials for Electronic Applications
Polymers, Processing, Reliability, Testing

by James J. Licari

  • Publisher : William Andrew
  • Release : 2003-06-11
  • Pages : 545
  • ISBN : 0815516479
  • Language : En, Es, Fr & De
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This first book in the Materials and Processes for Electronics Applications series answers questions vital to the successful design and manufacturing of electronic components, modules, and systems such as: - How can one protect electronic assemblies from prolonged high humidity, high temperatures, salt spray or other terrestrial and space environments? - What coating types can be used to protect microelectronics in military, space, automotive, or medical environments? - How can the chemistry of polymers be correlated to desirable physical and electrical properties? - How can a design engineer avoid subsequent potential failures due to corrosion, metal migration, electrical degradation, outgassing? - What are the best processes that manufacturing can use to mask, clean, prepare the surface, dispense the coating, and cure the coating? - What quality assurance and in-process tests can be used to assure reliability? - What government or industry specifications are available? - How can organic coatings be selected to meet OSHA, EPA, and other regulations? Besides a discussion of the traditional roles of coatings for moisture and environmental protection of printed circuit assemblies, this book covers dielectric coatings that provide electrical functions such as the low-dielectric-constant dielectrics used to fabricate multilayer interconnect substrates and high-frequency, high-speed circuits. Materials engineers and chemists will benefit greatly from a chapter on the chemistry and properties of the main types of polymer coatings including: Epoxies, Polyimides, Silicones, Polyurethanes, Parylene, Benzocyclobenzene and many others. For manufacturing personnel, there is an entire chapter of over a dozen processes for masking, cleaning, and surface preparation and a comprehensive review of over 20 processes for the application and curing of coatings including recent extrusion, meniscus, and curtain coating methods used in processing large panels. The pros and cons of each method are given to aid the engineer in selecting the optimum method for his/her application. As a bonus, from his own experience, the author discusses some caveats that will help reduce costs and avoid failures. Finally, the author discusses regulations of OSHA, EPA, and other government agencies which have resulted in formulation changes to meet VOC and toxicity requirements. Tables of numerous military, commercial, industry, and NASA specifications are given to help the engineer select the proper callout.

Japanese Technical Periodical Index

Japanese Technical Periodical Index
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1987
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002)

Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002)
10-12 December 2002, Grand Copthorne Waterfront Hotel, Singapore

by Charles Lee,Kok Chuan Toh,Mahadevan K. Iyer

  • Publisher : IEEE Standards Office
  • Release : 2002
  • Pages : 453
  • ISBN : 9780780374355
  • Language : En, Es, Fr & De
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Developments in Reinforced Plastics

Developments in Reinforced Plastics
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1980
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Electronics Packaging Technology Conference

Electronics Packaging Technology Conference
Proceedings of 3rd Electronics Packaging Technology Conference : (EPTC 2000) : 5-7 December, 2000, Sheraton Towers, Singapore

by Thiam Beng Lim

  • Publisher : Institute of Electrical & Electronics Engineers(IEEE)
  • Release : 2000
  • Pages : 467
  • ISBN : 9780780366442
  • Language : En, Es, Fr & De
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Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.

Chemical Week

Chemical Week
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 2002
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Adhesives, Sealants and Coatings for the Electronics Industry

Adhesives, Sealants and Coatings for the Electronics Industry
A Book

by Ernest W. Flick

  • Publisher : William Andrew
  • Release : 1992
  • Pages : 1002
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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The second edition of this widely accepted industrial guide contains descriptions of more than 2,500 adhesives, sealants, and coatings, which are available to the electronics and related industries. The book, greatly expanded from the previous edition, is the result of information received from 80 manufacturers and distributors of these products. The data, including product specifications, represent selections from the manufacturers' descriptions made at no cost to, nor influence from, the makers or distributors of these materials. Only the most recent information has been included. It is believed that all of the products listed are currently available, which will be of interest to readers concerned with product discontinuances.

Adhesives Technology Annual

Adhesives Technology Annual
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1978
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Application of Fracture Mechanics in Electronic Packaging

Application of Fracture Mechanics in Electronic Packaging
Presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

by American Society of Mechanical Engineers. Applied Mechanics Division

  • Publisher : Amer Society of Mechanical
  • Release : 1997
  • Pages : 193
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Twenty-three technical papers from the November 1997 symposium show how applications of the mechanics of fracture help to maintain the reliability of modern electronic components even while they become faster, smaller, and cheaper.

Thomas Register of American Manufacturers and Thomas Register Catalog File

Thomas Register of American Manufacturers and Thomas Register Catalog File
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 2003
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Vols. for 1970-71 includes manufacturers' catalogs.

PRODUCTS & SERVICES

PRODUCTS & SERVICES
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 2005
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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International Symposium on Advanced Packaging Materials

International Symposium on Advanced Packaging Materials
Processes, Properties and Interfaces : [proceedings]

by Anonim

  • Publisher : Unknown Publisher
  • Release : 2005
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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