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Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
Materials, Properties and Applications

by M O Alam,C Bailey

  • Publisher : Elsevier
  • Release : 2011-05-25
  • Pages : 280
  • ISBN : 0857092898
  • Language : En, Es, Fr & De
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Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Advanced Piezoelectric Materials

Advanced Piezoelectric Materials
Science and Technology

by Kenji Uchino

  • Publisher : Elsevier
  • Release : 2010-09-27
  • Pages : 696
  • ISBN : 1845699750
  • Language : En, Es, Fr & De
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Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications. After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress. With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering. Provides a comprehensive review of the new materials, their properties and methods of manufacture and application Explores the development of piezoelectric materials from the historical background to the present status Features an overview of manufacturing methods for piezoelectric ceramic materials including design considerations

35th Electronic Components Conference

35th Electronic Components Conference
May 20-22, 1985, Capital Hilton Hotel, Washington, D.C.

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1985
  • Pages : 516
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Electrically Conductive Adhesives

Electrically Conductive Adhesives
A Book

by Rajesh Gomatam,Kashmiri Lal Mittal

  • Publisher : BRILL
  • Release : 2008-12-23
  • Pages : 426
  • ISBN : 9004165924
  • Language : En, Es, Fr & De
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This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).

Electronic Packaging and Production

Electronic Packaging and Production
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1994
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Electronic Manufacturing

Electronic Manufacturing
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1987
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Advanced Materials Processing II

Advanced Materials Processing II
Proceedings of the 2nd International Conference on Advanced Materials Processing : Grand Hyatt, Singapore 2nd-4th December 2002

by Man On Lai,Li Lü

  • Publisher : Trans Tech Publication
  • Release : 2003
  • Pages : 510
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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This book presents the proceedings of the second International Conference on Advanced Materials Processing (ICAMP 2002). The papers read during the conference are included here in full-length form. They comprise 2 keynote addresses, 9 invited papers and over 130 oral presentations, by delegates from more than 20 countries.

Electrical & Electronics Abstracts

Electrical & Electronics Abstracts
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1997
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Electronics Packaging Technology Conference

Electronics Packaging Technology Conference
Proceedings of 3rd Electronics Packaging Technology Conference : (EPTC 2000) : 5-7 December, 2000, Sheraton Towers, Singapore

by Thiam Beng Lim

  • Publisher : Institute of Electrical & Electronics Engineers(IEEE)
  • Release : 2000
  • Pages : 467
  • ISBN : 9780780366442
  • Language : En, Es, Fr & De
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Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.

5th Electronics Packaging Technology Conference

5th Electronics Packaging Technology Conference
A Book

by Mahadevan K. Iyer,Kok Chuan Toh

  • Publisher : IEEE Computer Society Press
  • Release : 2003
  • Pages : 827
  • ISBN : 9780780382053
  • Language : En, Es, Fr & De
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International Symposium on Electronic Materials and Packaging

International Symposium on Electronic Materials and Packaging
(EMAP2000) : November 30-December 2, 2000, Hong Kong

by Anonim

  • Publisher : Institute of Electrical & Electronics Engineers(IEEE)
  • Release : 2000
  • Pages : 478
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Topics covered by this title include: flip chip running; solder join reliability; emerging technologies; solder materials; delimitation; polymers for packaging; design and process; modelling and testing; material characterization; and package reliability.

Bibliography of Microelectronics and Electronics Packaging and Interconnection References (1986-1989)

Bibliography of Microelectronics and Electronics Packaging and Interconnection References (1986-1989)
A Guide to the Literature of Semiconductor, Hybrid, Printed Circuit Assembly, and Surface Mount Technologies

by John F. Graves,Annette M. Gigone-Graves

  • Publisher : Unknown Publisher
  • Release : 1990-05
  • Pages : 420
  • ISBN : 9780961715212
  • Language : En, Es, Fr & De
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Canadian Electronics Engineering

Canadian Electronics Engineering
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1989
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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2002 8th International Advanced Packaging Materials Symposium

2002 8th International Advanced Packaging Materials Symposium
A Book

by Anonim

  • Publisher : Institute of Electrical & Electronics Engineers(IEEE)
  • Release : 2002
  • Pages : 379
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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This volume originates from the 2002 8th International Advanced Packaging Materials Symposium and covers topics including: bending of bare fibres; bare fibre under the combined action of bending and tension; polymer coated fibres; and solder materials and joints.

Technical Digest

Technical Digest
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1990
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Manufacturing Aspects in Electronic Packaging 1993

Manufacturing Aspects in Electronic Packaging 1993
Presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

by American Society of Mechanical Engineers. Winter Meeting

  • Publisher : Unknown Publisher
  • Release : 1993
  • Pages : 125
  • ISBN : 9780791810323
  • Language : En, Es, Fr & De
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Advanced Electronic Packaging: Volume 968

Advanced Electronic Packaging: Volume 968
A Book

by Vasudeva P. Atluri,Sujit Sharan,Ching-Pong Wong

  • Publisher : Materials Research Society
  • Release : 2007-04-09
  • Pages : 201
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Microelectronic packaging architecture evolutions are being driven by silicon technology advancements and new form factors, used models and emerging technologies. High-performance mobile computer and communication systems will require higher I/O counts, greater density, lower cost, lighter weight and improved performance in the electronic package. The book focuses on silicon technology dimension scaling and performance improvement, Pb-free or 'green' assembly, and system-in-package (SIP) technologies. It explores the key thermomechanical failure modes and mitigating solutions associated with integration of silicon with weak interlayer dielectrics during the assembly process, under bump metallurgy integrity with lead-free assembly, and the impact of stress on die-cracking and transistor performance in 3D thin-die stacking. The interaction of these failures with silicon and assembly materials, processes and design features is covered and includes: system in package; advanced packaging/nanotechnology in packaging; physical behavior and mechanical behavior in packaging; electromigration and thermal behavior in packaging and thin films and adhesives in packaging.

The Electrical Review

The Electrical Review
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1972
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Electronics

Electronics
Buyers' guide

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1975
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Electronic Materials, Technology, Here and Now

Electronic Materials, Technology, Here and Now
5th International SAMPE Electronics Conference, Los Angeles Airport Hilton Hotel, Los Angeles, California, June 18-20, 1991

by Society for the Advancement of Material and Process Engineering

  • Publisher : Society for Advancement of
  • Release : 1991
  • Pages : 644
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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