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Flash Memory Integration

Flash Memory Integration
Performance and Energy Issues

by Jalil Boukhobza,Pierre Olivier

  • Publisher : Elsevier
  • Release : 2017-03-10
  • Pages : 266
  • ISBN : 008101158X
  • Language : En, Es, Fr & De
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4 zettabytes (4 billion terabytes) of data generated in 2013, 44 zettabytes predicted for 2020 and 185 zettabytes for 2025. These figures are staggering and perfectly illustrate this new era of data deluge. Data has become a major economic and social challenge. The speed of processing of these data is the weakest link in a computer system: the storage system. It is therefore crucial to optimize this operation. During the last decade, storage systems have experienced a major revolution: the advent of flash memory. Flash Memory Integration: Performance and Energy Issues contributes to a better understanding of these revolutions. The authors offer us an insight into the integration of flash memory in computer systems, their behavior in performance and in power consumption compared to traditional storage systems. The book also presents, in their entirety, various methods for measuring the performance and energy consumption of storage systems for embedded as well as desktop/server computer systems. We are invited on a journey to the memories of the future. Ideal for computer scientists, featuring low level details to concentrate on system issues Tackles flash memory aspects while spanning domains such as embedded systems and HPC Contains an exhaustive set of experimental results conducted in the Lab-STICC laboratory Provides details on methodologies to perform performance and energy measurements on flash storage systems

Flash Memory Integration

Flash Memory Integration
Performance and Energy Considerations

by Jalil Boukhobza

  • Publisher : Unknown Publisher
  • Release : 2017
  • Pages : 250
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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ULSI Process Integration

ULSI Process Integration
Proceedings of the First International Symposium

by Cor L. Claeys

  • Publisher : The Electrochemical Society
  • Release : 1999
  • Pages : 386
  • ISBN : 9781566772419
  • Language : En, Es, Fr & De
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Data Intensive Storage Services for Cloud Environments

Data Intensive Storage Services for Cloud Environments
A Book

by Kyriazis, Dimosthenis

  • Publisher : IGI Global
  • Release : 2013-04-30
  • Pages : 342
  • ISBN : 1466639350
  • Language : En, Es, Fr & De
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With the evolution of digitized data, our society has become dependent on services to extract valuable information and enhance decision making by individuals, businesses, and government in all aspects of life. Therefore, emerging cloud-based infrastructures for storage have been widely thought of as the next generation solution for the reliance on data increases. Data Intensive Storage Services for Cloud Environments provides an overview of the current and potential approaches towards data storage services and its relationship to cloud environments. This reference source brings together research on storage technologies in cloud environments and various disciplines useful for both professionals and researchers.

Digital Storage in Consumer Electronics

Digital Storage in Consumer Electronics
The Essential Guide

by Thomas M. Coughlin

  • Publisher : Newnes
  • Release : 2011-08-30
  • Pages : 312
  • ISBN : 9780080558493
  • Language : En, Es, Fr & De
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Can you imagine life without your cell phone, laptop, digital camera, iPod, BlackBerry, flat-screen TV, or DVD player? The skyrocketing demand for devices that provide simple, immediate access to large amounts of content is driving required digital storage capacity to unprecedented levels. Designing digital storage into consumer electronics is crucial to the performance and cost of these devices. However, as our requirements for digital content storage grow, so does the formidable difficulty of implementing design solutions that are rugged, long-lasting, power-miserly, secure, network-accessible and can still fit in the palm of your hand! This book provides the background necessary to understand common digital storage devices and media. It helps readers decide which methods of storage work best for which kinds of devices, and then teaches designers how to successfully integrate them into consumer products. * Presents best practices for selecting, integrating, and using storage devices to achieve higher performance, greater reliability and lower cost * Teardown photos provide rare visuals of the "guts" of the devices discussed * Covers hot topics including flash memory, DVRs, Apple iPods, home networks, and automotive electronics, from basic layouts to standards, advanced features, and exciting growth opportunities

Inside NAND Flash Memories

Inside NAND Flash Memories
A Book

by Rino Micheloni,Luca Crippa,Alessia Marelli

  • Publisher : Springer Science & Business Media
  • Release : 2010-07-27
  • Pages : 582
  • ISBN : 9048194318
  • Language : En, Es, Fr & De
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Digital photography, MP3, digital video, etc. make extensive use of NAND-based Flash cards as storage media. To realize how much NAND Flash memories pervade every aspect of our life, just imagine how our recent habits would change if the NAND memories suddenly disappeared. To take a picture it would be necessary to find a film (as well as a traditional camera...), disks or even magnetic tapes would be used to record a video or to listen a song, and a cellular phone would return to be a simple mean of communication rather than a multimedia console. The development of NAND Flash memories will not be set down on the mere evolution of personal entertainment systems since a new killer application can trigger a further success: the replacement of Hard Disk Drives (HDDs) with Solid State Drives (SSDs). SSD is made up by a microcontroller and several NANDs. As NAND is the technology driver for IC circuits, Flash designers and technologists have to deal with a lot of challenges. Therefore, SSD (system) developers must understand Flash technology in order to exploit its benefits and countermeasure its weaknesses. Inside NAND Flash Memories is a comprehensive guide of the NAND world: from circuits design (analog and digital) to Flash reliability (including radiation effects), from testing issues to high-performance (DDR) interface, from error correction codes to NAND applications like Flash cards and SSDs.

ULSI Process Integration 7

ULSI Process Integration 7
A Book

by C. Claeys,H. Iwai,M. Tao,S. Deleonibus,J. Murota

  • Publisher : The Electrochemical Society
  • Release : 2011
  • Pages : 417
  • ISBN : 1607682613
  • Language : En, Es, Fr & De
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3D Flash Memories

3D Flash Memories
A Book

by Rino Micheloni

  • Publisher : Springer
  • Release : 2016-05-26
  • Pages : 380
  • ISBN : 9401775125
  • Language : En, Es, Fr & De
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This book walks the reader through the next step in the evolution of NAND flash memory technology, namely the development of 3D flash memories, in which multiple layers of memory cells are grown within the same piece of silicon. It describes their working principles, device architectures, fabrication techniques and practical implementations, and highlights why 3D flash is a brand new technology. After reviewing market trends for both NAND and solid state drives (SSDs), the book digs into the details of the flash memory cell itself, covering both floating gate and emerging charge trap technologies. There is a plethora of different materials and vertical integration schemes out there. New memory cells, new materials, new architectures (3D Stacked, BiCS and P-BiCS, 3D FG, 3D VG, 3D advanced architectures); basically, each NAND manufacturer has its own solution. Chapter 3 to chapter 7 offer a broad overview of how 3D can materialize. The 3D wave is impacting emerging memories as well and chapter 8 covers 3D RRAM (resistive RAM) crosspoint arrays. Visualizing 3D structures can be a challenge for the human brain: this is way all these chapters contain a lot of bird’s-eye views and cross sections along the 3 axes. The second part of the book is devoted to other important aspects, such as advanced packaging technology (i.e. TSV in chapter 9) and error correction codes, which have been leveraged to improve flash reliability for decades. Chapter 10 describes the evolution from legacy BCH to the most recent LDPC codes, while chapter 11 deals with some of the most recent advancements in the ECC field. Last but not least, chapter 12 looks at 3D flash memories from a system perspective. Is 14nm the last step for planar cells? Can 100 layers be integrated within the same piece of silicon? Is 4 bit/cell possible with 3D? Will 3D be reliable enough for enterprise and datacenter applications? These are some of the questions that this book helps answering by providing insights into 3D flash memory design, process technology and applications.

Solid-State Electronic Devices

Solid-State Electronic Devices
An Introduction

by Christo Papadopoulos

  • Publisher : Springer Science & Business Media
  • Release : 2013-11-19
  • Pages : 277
  • ISBN : 1461488362
  • Language : En, Es, Fr & De
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A modern and concise treatment of the solid state electronic devices that are fundamental to electronic systems and information technology is provided in this book. The main devices that comprise semiconductor integrated circuits are covered in a clear manner accessible to the wide range of scientific and engineering disciplines that are impacted by this technology. Catering to a wider audience is becoming increasingly important as the field of electronic materials and devices becomes more interdisciplinary, with applications in biology, chemistry and electro-mechanical devices (to name a few) becoming more prevalent. Updated and state-of-the-art advancements are included along with emerging trends in electronic devices and their applications. In addition, an appendix containing the relevant physical background will be included to assist readers from different disciplines and provide a review for those more familiar with the area. Readers of this book can expect to derive a solid foundation for understanding modern electronic devices and also be prepared for future developments and advancements in this far-reaching area of science and technology.

Embedded Flash Memory for Embedded Systems: Technology, Design for Sub-systems, and Innovations

Embedded Flash Memory for Embedded Systems: Technology, Design for Sub-systems, and Innovations
A Book

by Hideto Hidaka

  • Publisher : Springer
  • Release : 2017-09-09
  • Pages : 247
  • ISBN : 3319553062
  • Language : En, Es, Fr & De
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This book provides a comprehensive introduction to embedded flash memory, describing the history, current status, and future projections for technology, circuits, and systems applications. The authors describe current main-stream embedded flash technologies from floating-gate 1Tr, floating-gate with split-gate (1.5Tr), and 1Tr/1.5Tr SONOS flash technologies and their successful creation of various applications. Comparisons of these embedded flash technologies and future projections are also provided. The authors demonstrate a variety of embedded applications for auto-motive, smart-IC cards, and low-power, representing the leading-edge technology developments for eFlash. The discussion also includes insights into future prospects of application-driven non-volatile memory technology in the era of smart advanced automotive system, such as ADAS (Advanced Driver Assistance System) and IoE (Internet of Everything). Trials on technology convergence and future prospects of embedded non-volatile memory in the new memory hierarchy are also described. Introduces the history of embedded flash memory technology for micro-controller products and how embedded flash innovations developed; Includes comprehensive and detailed descriptions of current main-stream embedded flash memory technologies, sub-system designs and applications; Explains why embedded flash memory requirements are different from those of stand-alone flash memory and how to achieve specific goals with technology development and circuit designs; Describes a mature and stable floating-gate 1Tr cell technology imported from stand-alone flash memory products - that then introduces embedded-specific split-gate memory cell technologies based on floating-gate storage structure and charge-trapping SONOS technology and their eFlash sub-system designs; Describes automotive and smart-IC card applications requirements and achievements in advanced eFlash beyond 4 0nm node.

Flash Memories

Flash Memories
A Book

by Paulo Cappelletti,Carla Golla,Piero Olivo,Enrico Zanoni

  • Publisher : Springer Science & Business Media
  • Release : 2013-11-27
  • Pages : 540
  • ISBN : 1461550157
  • Language : En, Es, Fr & De
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A Flash memory is a Non Volatile Memory (NVM) whose "unit cells" are fabricated in CMOS technology and programmed and erased electrically. In 1971, Frohman-Bentchkowsky developed a folating polysilicon gate tran sistor [1, 2], in which hot electrons were injected in the floating gate and removed by either Ultra-Violet (UV) internal photoemission or by Fowler Nordheim tunneling. This is the "unit cell" of EPROM (Electrically Pro grammable Read Only Memory), which, consisting of a single transistor, can be very densely integrated. EPROM memories are electrically programmed and erased by UV exposure for 20-30 mins. In the late 1970s, there have been many efforts to develop an electrically erasable EPROM, which resulted in EEPROMs (Electrically Erasable Programmable ROMs). EEPROMs use hot electron tunneling for program and Fowler-Nordheim tunneling for erase. The EEPROM cell consists of two transistors and a tunnel oxide, thus it is two or three times the size of an EPROM. Successively, the combination of hot carrier programming and tunnel erase was rediscovered to achieve a single transistor EEPROM, called Flash EEPROM. The first cell based on this concept has been presented in 1979 [3]; the first commercial product, a 256K memory chip, has been presented by Toshiba in 1984 [4]. The market did not take off until this technology was proven to be reliable and manufacturable [5].

Integrated Interconnect Technologies for 3D Nanoelectronic Systems

Integrated Interconnect Technologies for 3D Nanoelectronic Systems
A Book

by Muhannad S. Bakir,James D. Meindl

  • Publisher : Artech House
  • Release : 2008-11-30
  • Pages : 528
  • ISBN : 1596932473
  • Language : En, Es, Fr & De
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This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.

NAND Flash Memory Technologies

NAND Flash Memory Technologies
A Book

by Seiichi Aritome

  • Publisher : John Wiley & Sons
  • Release : 2015-12-29
  • Pages : 432
  • ISBN : 1119132606
  • Language : En, Es, Fr & De
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Offers a comprehensive overview of NAND flash memories, with insights into NAND history, technology, challenges, evolutions, and perspectives Describes new program disturb issues, data retention, power consumption, and possible solutions for the challenges of 3D NAND flash memory Written by an authority in NAND flash memory technology, with over 25 years’ experience

Inside Solid State Drives (SSDs)

Inside Solid State Drives (SSDs)
A Book

by Rino Micheloni,Alessia Marelli,Kam Eshghi

  • Publisher : Springer
  • Release : 2018-07-11
  • Pages : 485
  • ISBN : 9811305994
  • Language : En, Es, Fr & De
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The revised second edition of this respected text provides a state-of-the-art overview of the main topics relating to solid state drives (SSDs), covering NAND flash memories, memory controllers (including booth hardware and software), I/O interfaces (PCIe/SAS/SATA), reliability, error correction codes (BCH and LDPC), encryption, flash signal processing and hybrid storage. Updated throughout to include all recent work in the field, significant changes for the new edition include: A new chapter on flash memory errors and data recovery procedures in SSDs for reliability and lifetime improvement Updated coverage of SSD Architecture and PCI Express Interfaces moving from PCIe Gen3 to PCIe Gen4 and including a section on NVMe over fabric (NVMf) An additional section on 3D flash memories An update on standard reliability procedures for SSDs Expanded coverage of BCH for SSDs, with a specific section on detection A new section on non-binary Low-Density Parity-Check (LDPC) codes, the most recent advancement in the field A description of randomization in the protection of SSD data against attacks, particularly relevant to 3D architectures The SSD market is booming, with many industries placing a huge effort in this space, spending billions of dollars in R&D and product development. Moreover, flash manufacturers are now moving to 3D architectures, thus enabling an even higher level of storage capacity. This book takes the reader through the fundamentals and brings them up to speed with the most recent developments in the field, and is suitable for advanced students, researchers and engineers alike.

Memories in Wireless Systems

Memories in Wireless Systems
A Book

by Rino Micheloni,Giovanni Campardo,Piero Olivo

  • Publisher : Springer Science & Business Media
  • Release : 2008-07-24
  • Pages : 310
  • ISBN : 3540790780
  • Language : En, Es, Fr & De
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For the technological progress in communication technology it is necessary that the advanced studies in circuit and software design are accompanied with recent results of the technological research and physics in order to exceed its limitations. This book is a guide which treats many components used in mobile communications, and in particular focuses on non-volatile memories. It emerges following the conducting line of the non-volatile memory in the wireless system: On the one hand it develops the foundations of the interdisciplinary issues needed for design analysis and testing of the system. On the other hand it deals with many of the problems appearing when the systems are realized in industrial production. These cover the difficulties from the mobile system to the different types of non-volatile memories. The book explores memory cards, multichip technologies, and algorithms of the software management as well as error handling. It also presents techniques of assurance for the single components and a guide through the Datasheet lectures.

Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10

Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10
A Book

by Takeshi Hattori

  • Publisher : The Electrochemical Society
  • Release : 2007-01-01
  • Pages : 481
  • ISBN : 156677568X
  • Language : En, Es, Fr & De
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This issue covers topics related to the removal of contaminants from and conditioning of Si (SOI), SiC, Ge, SiGe, and III-V semiconductor surfaces; cleaning media, including non-aqueous cleaning methods and tools; front- and back-end cleaning operations; integrated cleaning; cleaning of MEMS; photomasks (reticles); porous low-k dielectrics; post-CMP cleaning; wafer bevel cleaning and polishing; characterization, evaluation, and monitoring of cleaning; correlation with device performance as well as cleaning of equipment and storage and handling hardware. The hardcover edition includes a bonus CD-ROM of Cleaning Technology in Semiconductor Device Manufacturing 1989?2007: Proceedings from the ECS Semiconductor Cleaning Symposia 1?10. This bonus material is not available with the PDF edition.

Silicon Based Unified Memory Devices and Technology

Silicon Based Unified Memory Devices and Technology
A Book

by Arup Bhattacharyya

  • Publisher : CRC Press
  • Release : 2017-07-06
  • Pages : 512
  • ISBN : 1351798324
  • Language : En, Es, Fr & De
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The primary focus of this book is on basic device concepts, memory cell design, and process technology integration. The first part provides in-depth coverage of conventional nonvolatile memory devices, stack structures from device physics, historical perspectives, and identifies limitations of conventional devices. The second part reviews advances made in reducing and/or eliminating existing limitations of NVM device parameters from the standpoint of device scalability, application extendibility, and reliability. The final part proposes multiple options of silicon based unified (nonvolatile) memory cell concepts and stack designs (SUMs). The book provides Industrial R&D personnel with the knowledge to drive the future memory technology with the established silicon FET-based establishments of their own. It explores application potentials of memory in areas such as robotics, avionics, health-industry, space vehicles, space sciences, bio-imaging, genetics etc.

Nonvolatile Memory Technologies with Emphasis on Flash

Nonvolatile Memory Technologies with Emphasis on Flash
A Comprehensive Guide to Understanding and Using Flash Memory Devices

by Joe Brewer,Manzur Gill

  • Publisher : John Wiley & Sons
  • Release : 2011-09-23
  • Pages : 792
  • ISBN : 1118211626
  • Language : En, Es, Fr & De
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Presented here is an all-inclusive treatment of Flash technology, including Flash memory chips, Flash embedded in logic, binary cell Flash, and multilevel cell Flash. The book begins with a tutorial of elementary concepts to orient readers who are less familiar with the subject. Next, it covers all aspects and variations of Flash technology at a mature engineering level: basic device structures, principles of operation, related process technologies, circuit design, overall design tradeoffs, device testing, reliability, and applications.

System Integration

System Integration
From Transistor Design to Large Scale Integrated Circuits

by Kurt Hoffmann

  • Publisher : John Wiley & Sons
  • Release : 2006-02-08
  • Pages : 510
  • ISBN : 0470020695
  • Language : En, Es, Fr & De
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The development of large-scale integrated systems on a chip has had a dramatic effect on circuit design methodology. Recent years have seen an escalation of interest in systems level integration (system-on-a-chip) and the development of low power, high chip density circuits and systems. Kurt Hoffmann sets out to address a wide range of issues relating to the design and integration of integrated circuit components and provides readers with the methodology by which simple equations for the estimation of transistor geometries and circuit behaviour can be deduced. The broad coverage of this unique book ranges from field effect transistor design, MOS transistor modelling and the fundamentals of digital CMOS circuit design through to MOS memory architecture and design. Highlights the increasing requirement for information on system-on-a-chip design and integration. Combines coverage of semiconductor physics, digital VLSI design and analog integrated circuits in one volume for the first time. Written with the aim of bridging the gap between semiconductor device physics and practical circuit design. Introduces the basic behaviour of semiconductor components for ICs and covers the design of both digital and analog circuits in CMOS and BiCMOS technologies. Broad coverage will appeal to both students and practising engineers alike. Written by a respected expert in the field with a proven track record of publications in this field. Drawing upon considerable experience within both industry and academia, Hoffmann’s outstanding text, will prove an invaluable resource for designers, practising engineers in the semiconductor device field and electronics systems industry as well as Postgraduate students of microelectronics, electrical and computer engineering.

Heterogeneous Integrations

Heterogeneous Integrations
A Book

by John H. Lau

  • Publisher : Springer
  • Release : 2019-04-03
  • Pages : 368
  • ISBN : 9811372241
  • Language : En, Es, Fr & De
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Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.