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Three-Dimensional Molded Interconnect Devices (3D-MID)

Three-Dimensional Molded Interconnect Devices (3D-MID)
Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

by Jörg Franke

  • Publisher : Carl Hanser Verlag GmbH Co KG
  • Release : 2014-04-03
  • Pages : 368
  • ISBN : 1569905525
  • Language : En, Es, Fr & De
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Three-dimensional molded interconnect devices (MIDs) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MIDs are made primarily of recyclable thermoplastics, so they are more environmentally compatible than alternatives produced using other available technologies. MIDs are used in virtually every sector of electronics. The many standard applications for MIDs in the automotive industry in particular also drive for further development and research into MID technology. The significance of MID technology is also increasing in medical engineering, IT and telecommunications and in industrial automation, with numerous applications now successfully implemented in all these various fields. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

11th International Congress Molded Interconnect Devices – Scientific Proceedings

11th International Congress Molded Interconnect Devices – Scientific Proceedings
A Book

by Jörg Franke,Thomas Kuhn,Albert Birkicht,Andreas Pojtinger

  • Publisher : Trans Tech Publications Ltd
  • Release : 2014-09-26
  • Pages : 130
  • ISBN : 3038266361
  • Language : En, Es, Fr & De
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Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability.

Proceedings of the 6th CIRP-Sponsored International Conference on Digital Enterprise Technology

Proceedings of the 6th CIRP-Sponsored International Conference on Digital Enterprise Technology
A Book

by George Q. Huang,K.L. Mak,Paul G. Maropoulos

  • Publisher : Springer Science & Business Media
  • Release : 2009-12-12
  • Pages : 1803
  • ISBN : 9783642104305
  • Language : En, Es, Fr & De
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This Proceedings volume contains articles presented at the CIRP-Sponsored Inter- tional Conference on Digital Enterprise Technology (DET2009) that takes place December 14–16, 2009 in Hong Kong. This is the 6th DET conference in the series and the first to be held in Asia. Professor Paul Maropoulos initiated, hosted and chaired the 1st International DET Conference held in 2002 at the University of D- ham. Since this inaugural first DET conference, DET conference series has been s- cessfully held in 2004 at Seattle, Washington USA, in 2006 at Setubal Portugal, in 2007 at Bath England, and in 2008 at Nantes France. The DET2009 conference continues to bring together International expertise from the academic and industrial fields, pushing forward the boundaries of research kno- edge and best practice in digital enterprise technology for design and manufacturing, and logistics and supply chain management. Over 120 papers from over 10 countries have been accepted for presentation at DET2009 and inclusion in this Proceedings volume after stringent refereeing process. On behalf of the organizing and program committees, the Editors are grateful to the many people who have made DET2009 possible: to the authors and presenters, es- cially the keynote speakers, to those who have diligently reviewed submissions, to members of International Scientific Committee, Organizing Committee and Advisory Committes, and to colleagues for their hard work in sorting out all the arrangements. We would also like to extend our gratitude to DET2009 sponsors, co-organizers, and supporting organizations.

Polymers in Organic Electronics

Polymers in Organic Electronics
Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems

by Sulaiman Khalifeh

  • Publisher : Elsevier
  • Release : 2020-04-01
  • Pages : 616
  • ISBN : 192788568X
  • Language : En, Es, Fr & De
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Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system. Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers Covers the most common electrical, electronic, and optical properties of electronic polymers Describes the underlying theories on the mechanics of polymer conductivity Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components

Polymers in Electronics 2007

Polymers in Electronics 2007
A Book

by Anonim

  • Publisher : iSmithers Rapra Publishing
  • Release : 2007
  • Pages : 208
  • ISBN : 9781847350091
  • Language : En, Es, Fr & De
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This conference saw presentations from all parts of the electronics industry's materials supply chain, from raw materials to finished products and offered an opportunity to learn more about both traditional and new polymer materials, their markets, manufacturing processes and applications. It also covered the impact of legislation, the need to recycle and other polymer related challenges and opportunities for the industry.

Microengineering of Metals and Ceramics, Part I

Microengineering of Metals and Ceramics, Part I
Design, Tooling, and Injection Molding

by Henry Baltes,Oliver Brand,Gary K. Fedder,Christofer Hierold,Jan G. Korvink,Osamu Tabata,Detlef Löhe,Jürgen Hausselt

  • Publisher : John Wiley & Sons
  • Release : 2008-09-26
  • Pages : 392
  • ISBN : 3527616942
  • Language : En, Es, Fr & De
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Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. In this volume, authors from three major competence centres for microengineering illustrate step by step the process from designing and simulating microcomponents of metallic and ceramic materials to replicating micro-scale components by injection molding.

2003 International Symposium on Microelectronics

2003 International Symposium on Microelectronics
IMAPS : proceedings : November 18-20, 2003, Hynes Convention Center, Boston, MA

by Ken Gilleo,International Microelectronics and Packaging Society,American Ceramic Society,Society of Photo-optical Instrumentation Engineers

  • Publisher : Society of Photo Optical
  • Release : 2003-11-01
  • Pages : 1013
  • ISBN : 9780819451897
  • Language : En, Es, Fr & De
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Manufacturing Engineering and Automation I

Manufacturing Engineering and Automation I
A Book

by Liangchi Zhang,Chun Liang Zhang,Tie Lin Shi

  • Publisher : Trans Tech Publications Ltd
  • Release : 2010-10-19
  • Pages : 2880
  • ISBN : 3038133922
  • Language : En, Es, Fr & De
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This special volume brings together the latest advances in, and applications of, Manufacturing Engineering and Automation. It comprises 598 peer-reviewed papers selected from over 1000 papers submitted by universities and industrial concerns all over the world. Volume is indexed by Thomson Reuters CPCI-S (WoS).

Microengineering of Metals and Ceramics

Microengineering of Metals and Ceramics
Special Replication Techniques, Automation, and Properties

by Henry Baltes,Oliver Brand,Gary K. Fedder,Christofer Hierold,Jan G. Korvink,Osamu Tabata,Detlef Löhe,Jürgen Hausselt

  • Publisher : Wiley-VCH
  • Release : 2005
  • Pages : 306
  • ISBN : 9783527314935
  • Language : En, Es, Fr & De
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Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Continuing from the previous volume, authors from three major competence centres for microengineering here cover all aspects of specialized replication techniques and how to employ state-of-the-art technologies for testing and characterizing micro-scale components, and illustrate quality control aspects and strategies for automation of production procedures in view of future industrial production and commercialisation.

Innovation

Innovation
The Journal of the Industrial Designers Society of America

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1994
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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One issue each year consists of an annual conference review.

Microwave Journal

Microwave Journal
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 2004
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Laser Applications in Microelectronic and Optoelectronic Manufacturing

Laser Applications in Microelectronic and Optoelectronic Manufacturing
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 2001
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Electrical & Electronics Abstracts

Electrical & Electronics Abstracts
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1997
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Fifth International Symposium on Laser Precision Microfabrication

Fifth International Symposium on Laser Precision Microfabrication
11-14 May, 2004, Nara, Japan

by Isamu Miyamoto

  • Publisher : Society of Photo Optical
  • Release : 2004
  • Pages : 770
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

Index of Conference Proceedings

Index of Conference Proceedings
Annual cumulation

by British Library. Document Supply Centre

  • Publisher : Unknown Publisher
  • Release : 1997
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Concurrent Engineering, a Global Perspective

Concurrent Engineering, a Global Perspective
Proceedings of Concurrent Engineering 1995 Conference, McLean, Virginia, 23-25 August 1995

by J. Paul Anand,Michael Sobolewski

  • Publisher : Unknown Publisher
  • Release : 1995
  • Pages : 675
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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Proceedings of Concurrent Engineering ... Conference

Proceedings of Concurrent Engineering ... Conference
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1995
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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32nd Annual Connector and Interconnection Symposium and Trade Show

32nd Annual Connector and Interconnection Symposium and Trade Show
Anaheim, California, September, 27-29, 1999 ; [1999 Proceedings]

by Connector and Interconnection Symposium and Trade Show

  • Publisher : Unknown Publisher
  • Release : 1999
  • Pages : 302
  • ISBN : 9781929461011
  • Language : En, Es, Fr & De
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Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium
Integrated Manufacturing, the Future is Now : September 28-30, 1992, Baltimore, MD, USA

by Anonim

  • Publisher : Institute of Electrical & Electronics Engineers(IEEE)
  • Release : 1992
  • Pages : 381
  • ISBN : 9780780307568
  • Language : En, Es, Fr & De
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Proceedings of the CIRP Seminars on Manufacturing Systems/fertigungssysteme/systèmes de Fabrication

Proceedings of the CIRP Seminars on Manufacturing Systems/fertigungssysteme/systèmes de Fabrication
A Book

by Anonim

  • Publisher : Unknown Publisher
  • Release : 1999
  • Pages : 329
  • ISBN : 9876543210XXX
  • Language : En, Es, Fr & De
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